| ASE-ORIENT-SEMICONDUCTOR-ELECTRONICS-LIMITED |
ASE-ORIENT-SEMICONDUCTOR-ELECTRONICS-LIMITED |
85%
|
. Following wafer fabrication, our wafers are shipped to our assembly and test subcontractors where they are probed, singulated into individual dies, assembled into packaged chips, and undergo the pr… |
| HT-TONGFU-MICROELECTRONICS-CO-LTD |
HT-TONGFU-MICROELECTRONICS-CO-LTD |
85%
|
. Following wafer fabrication, our wafers are shipped to our assembly and test subcontractors where they are probed, singulated into individual dies, assembled into packaged chips, and undergo the pr… |
| SILICONWARE-PRECISION-INDUSTRIES-LTD |
SILICONWARE-PRECISION-INDUSTRIES-LTD |
85%
|
. Following wafer fabrication, our wafers are shipped to our assembly and test subcontractors where they are probed, singulated into individual dies, assembled into packaged chips, and undergo the pr… |
| SPIL-POWERTECH-TECHNOLOGY-INC |
SPIL-POWERTECH-TECHNOLOGY-INC |
85%
|
. Following wafer fabrication, our wafers are shipped to our assembly and test subcontractors where they are probed, singulated into individual dies, assembled into packaged chips, and undergo the pr… |
| TF-KING-YUAN-ELECTRONICS-CORP |
TF-KING-YUAN-ELECTRONICS-CORP |
85%
|
. Following wafer fabrication, our wafers are shipped to our assembly and test subcontractors where they are probed, singulated into individual dies, assembled into packaged chips, and undergo the pr… |
| YOUNGTEK-ELECTRONICS-CORP |
YOUNGTEK-ELECTRONICS-CORP |
85%
|
. Following wafer fabrication, our wafers are shipped to our assembly and test subcontractors where they are probed, singulated into individual dies, assembled into packaged chips, and undergo the pr… |
| MXL |
MaxLinear, Inc. |
72%
|
Reciprocal relationship from MXL graph: to Asian ODMs and contract manufacturers delivering products into European and North American markets. To date, all of our sales have been denominated in Unite… |